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Planar Lightwave Circuitary Packaging

The Splitter modules are available with 1xN up to 64 and 2xN up to 32 channel configurations and also supplied with various connectorized cassette modules


Passive Thermal & Athermal DWDM AWG Packaging

PLC type VOA and Integrate Switches


 

PM has a strong process capabilities for supporting our customer for PLC modules packaging. Which including :
           Wafer Dicing
           Cover Lid Attachment
           Chip Polishing
           V-groove Cutting & Fiber Array Assembly
           Coupling
           Mechanical Assembly
           Performance Testing
           Reliability testing & Product Qualification 
           
           
Our professionals and expertise in various aspects including telecommunication, fiber optic transmission, opto-electronic, microelectronic component packaging, material science, high precision technology and industrial automation. PMS is committed to delighting its customers by providing world-class facility, technology, quality, delivery and value-added service in competitive total cost of ownership.

 



 



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