The Photonic Manufacturing Service Ltd. Is equipped world-class equipments to
manufacture high performance fiber optic components
which are including planar lightwave products, pigtail type mini-size micro-optic components
and butterfly packaging . Our full-spectrum of manufacturing processes are ready to do the
packaging for your unique fiber optic products & sub-systems.
With our volume production experience of:
Micro-Optic Products :
Butterfly Packaging Products :
|Leveraging PM extensive process and engineering capability from photonic Wafer processing, micro optics to fiberoptics components and function optical modules, optical parts to optical assembly, passive to active assemblies, PM provides optimized packaging solutions to your product development, contract manufacturing, and technical transfer projects.|
|PM's packaging solutions that are vertically integrated with our manufacturing, logistics, component, and functional module technologies to optimize customers' engineering, production ramp-up, and operations by competitive costs and reducing time to market.|
The Application of the state-of-the-art high precision and effective cleaning methods such as mega sonic cleaning, snow CO2 jet cleaning, and plasma cleaning, enables us to remove sub-micron foreign materials and any form of contaminations on the surfaces to be assembled and hence to ensure high product performance and reliability.
Ultra Precision Machining
Due to the harsh sub-micron positional accuracy requirement in fiber optics component manufacturing,
fabrication of photonic components such as Pyrex v-groove substrate for fiber array and optical workbench is
critical in achieving high quality products with minimal insertion loss. Solutions can be provided with our
sub-micron precision machining technology.
Automatics Alignment System
Equipped with the powerful NEWPORT automatic alignment system, highly flexible optical alignment with 6 degree of freedom (automatic) in nano-scale resolution, both actively and passively, can be achieved in very short time. Our experienced engineer can hence perform alignment for any types of component/module configurations, within the specified tolerance from you.
NANO-Scale Pitch Measurement System
To fulfill the customer quality requirement - our ultimate target and commitment, we equipped with
the SURUGA Core-Pitch Pro. measurement system, which enforce us to measure the component
fiber core-pitch with accuracy down to 0.03mm before assembling the modules.
Optical Grade Polishing
End-face surface finishing is a critical factor in determining the coupling loss of a photonic component. Our extensive experience and fundamental knowledge in material surface preparation and finishing, together with the ENGIS high precision optical polishing system, enable us to provide PC, APC, UPC, and FC end-face configuration which compliance with the Telcordia GR-326-CORE end-face quality requirement.
Thanks to the Newport's LaserWeld automated packaging workstation, we are able to perform fully automated optical alignment, device characterization, and laser welding processing for 980nm pump and DFB laser diode assembly, and any DIP or Butterfly package applications.
Flip Chip Bonding
|For the laser diode attachment on the submount of various active photonic packages, we have equipped high precision die bonders with a placement accuracy of 5 microns or better. Moreover, to keep pace with the high growth photonic market, we have also equipped fully automated flip chip bonders (ESEC Micron 2) with high throughput, high accuracy and high flexibility to suit for the high volume production demand.|
Die and Wire Bonding
|In order to achieve a better reliability and greatly enhance the life of your photonic products, we have equipped the state-of-the-art hermetic sealing facility to provide hermetically weld and solder seal ceramic, stainless steel, Kovar? and other metal packages. We can assemble and seal your product in an inert atmosphere with moisture and oxygen monitoring.|
With in-depth knowledge in various joining materials such as solder, polymer, glue, adhesive etc., we are able to manage various types of component snap fixing methodology including UV and thermal cure adhesive fixing, soldering, laser welding etc. - definitely with minimal shrinking, mis-alignment and residual stress.