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Butterfly Packaging

The Photonic Manufacturing Service Ltd. is equipped with world-class equipments to provide packaging service for the 14-Pin Butterfly Module, Mini-DIL Module.


Our vertical integration processes can enable us to support our customers for their current products manufacturing requirement and the new product to be developed in the future.


Our manufacturing processes capability included :

Process

Facility

Specifications

Die bonding

Cammax Precima: EDB-80
                       Karl Suss: FC150
                       Finetech: Fineplacera Pico MA
                       Sysmelec SMB 1000

Accuracy: +/- 1.0mm to +/- 5.0um

Sub-Assembly mounting/
                       Step build

Karl Suss: FC150
                       Finetech: Fineplacera Pico MA
                       Vacuum Reflow Oven
                       Sysmelec SMB 1000

Accuracy: +/- 5.0mm to +/- 50.0um

Wire Bonding

KNS 4524, 4124, 4129
                       West Bond 4500B

Au Wire; Al Wire; Au Ribbon Wire
                       Low Temp & low force bonding

Fiber Lensing

Krell Technologies - SpecMaster II Optical Fiber Polishing System

Lens Tip Radius 5~10um
                       Wedge Lens angle 60-120+/- 1o

Metallization

ISE-PVD-3000 Sputtering System

Cr-Ni-Au, Ti-Pt-Au & etc.
                       Bending test = 5.0 mm
                       Pull strength > 1.5kgf
                       Leak rate < 1x10-10 atm cc/s He

Ferrule Soldering

Induction Heating System

Pull Strength > 1.5kgf
                       Leak rate < 1x10-10 atm cc/s He

Auto-alignment & Laser Welding

Newport: LW 4200 and LW 4500

Accuracy = +/-0.1 mm
                       Coupling efficiency >70%

Seam Sealing

Benchmark Gen II

 

 

 


 








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